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Bergquist Company

Bergquist Company

Bergquist's guiding principles are innovation, performance and customer satisfaction. Today, Bergquist supplies the world with some of the best-known brands in the business: Sil-Pad® thermally conductive interface materials, Gap Pad® electrically insulating and non-insulating gap fillers, Hi-Flow® phase change grease replacement materials, Bond-Ply™ thermally conductive adhesive tapes, and Thermal Clad® insulated metal substrates.
圖片 型號 品牌 封裝 數量 描述 PDF資料
點擊查看803808參考圖片 803808 Bergquist Company 熱基質 - MCPCB 1-UP INDV STAR OSRAM OSTAR SMT
參數:制造商:Bergquist Company,RoHS:是,配置:Star Board,設計目的:Osram OSTAR SMT,芯體材料:Aluminum,導熱...
點擊查看804450參考圖片 804450 Bergquist Company 熱基質 - MCPCB 1-UP INDV STAR CREE MX-6
參數:制造商:Bergquist Company,RoHS:是,配置:Star Board,設計目的:Cree MX-6,芯體材料:Aluminum,導熱性:1.3 ...
點擊查看804511參考圖片 804511 Bergquist Company 熱基質 - MCPCB 1-UP INDV STAR CREE XP-G
參數:制造商:Bergquist Company,RoHS:是,配置:Star Board,設計目的:Cree XP-G,芯體材料:Aluminum,導熱性:1.3 ...
點擊查看804936參考圖片 804936 Bergquist Company 熱基質 - MCPCB 1-UP INDV STAR CREE XML
參數:制造商:Bergquist Company,產品種類:熱基質 - MCPCB,RoHS:是,配置:Star Board,設計目的:Cree XM-L,芯體材料:...
點擊查看805245參考圖片 805245 Bergquist Company 熱基質 - MCPCB 1-UP INDV STAR CREE MTG
參數:制造商:Bergquist Company,產品種類:熱基質 - MCPCB,RoHS:是,配置:Star Board,設計目的:Cree MT-G,芯體材料:...

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